JPH0476052U - - Google Patents

Info

Publication number
JPH0476052U
JPH0476052U JP11968990U JP11968990U JPH0476052U JP H0476052 U JPH0476052 U JP H0476052U JP 11968990 U JP11968990 U JP 11968990U JP 11968990 U JP11968990 U JP 11968990U JP H0476052 U JPH0476052 U JP H0476052U
Authority
JP
Japan
Prior art keywords
lead
leads
semiconductor device
cathode
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11968990U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0744025Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990119689U priority Critical patent/JPH0744025Y2/ja
Publication of JPH0476052U publication Critical patent/JPH0476052U/ja
Application granted granted Critical
Publication of JPH0744025Y2 publication Critical patent/JPH0744025Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1990119689U 1990-11-15 1990-11-15 リードの半田メッキ装置 Expired - Lifetime JPH0744025Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990119689U JPH0744025Y2 (ja) 1990-11-15 1990-11-15 リードの半田メッキ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990119689U JPH0744025Y2 (ja) 1990-11-15 1990-11-15 リードの半田メッキ装置

Publications (2)

Publication Number Publication Date
JPH0476052U true JPH0476052U (en]) 1992-07-02
JPH0744025Y2 JPH0744025Y2 (ja) 1995-10-09

Family

ID=31867632

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990119689U Expired - Lifetime JPH0744025Y2 (ja) 1990-11-15 1990-11-15 リードの半田メッキ装置

Country Status (1)

Country Link
JP (1) JPH0744025Y2 (en])

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63263752A (ja) * 1987-04-22 1988-10-31 Nec Corp 高速部分めつき装置
JPH02111898A (ja) * 1988-10-20 1990-04-24 Mitsubishi Electric Corp 半導体素子の製造装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63263752A (ja) * 1987-04-22 1988-10-31 Nec Corp 高速部分めつき装置
JPH02111898A (ja) * 1988-10-20 1990-04-24 Mitsubishi Electric Corp 半導体素子の製造装置

Also Published As

Publication number Publication date
JPH0744025Y2 (ja) 1995-10-09

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term